Robotics Engineering – Robot Builders Guide

August 11th, 2009

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Pages: 258

Robotics Engineering – Robot Builders Guide

Table of Content

1 Assembly Manual
1.1 Electronic Assembly Technique
1.1.1 Soldering Technique
1.1.2 Desoldering Technique
1.1.3 Component Types and Polarity
1.1.4 Component Mounting
1.1.5 Component Value Markings
1.2 The Microprocessor Board
1.2.1 Assembling the Microprocessor Board
1.2.2 Testing the Microprocessor Board
1.2.3 After Board Checkout
1.3 The Expansion Board
1.3.1 Assembling the Expansion Board
1.3.2 Testing the Expansion Board
1.3.3 After Board Testing
1.4 The LCD Display
1.5 The Battery System
1.5.1 The Battery Charger
1.5.2 Battery Pack Construction
1.6 The Infrared Transmitter
1.6.1 Assembly Instructions
1.7 The Motor Switch Board
1.7.1 Assembly Instructions
1.8 Cable and Connector Wiring
1.9 Sensor Wiring
1.9.1 Touch Sensors
1.9.2 Photocell Light Sensor
1.9.3 Infrared Reectance Sensor
1.9.4 Single Bend Sensor
1.9.5 Dual Bend Sensor
1.9.6 Sharp Infrared Sensor
1.9.7 Potentiometer
1.9.8 Slotted Optical Switch
1.9.9 Hall Eect Sensor
1.10 Motor Wiring
1.10.1 The Polaroid Motor
1.10.2 Servo Motor
1.11 Computer Cable Wiring

2 Motors
2.1 DC Motors
2.1.1 Ratings and Specications
2.1.2 Measuring Motor Torque
2.1.3 Speed, Torque, and Gear Reduction
2.1.4 Pulse Width Modulation
2.2 Stepper Motors
2.3 Servo Motors
2.3.1 Control
2.3.2 Application

3 Batteries
3.1 Cell Characteristics
3.1.1 Voltage
3.1.2 Capacity
3.1.3 Power Density
3.1.4 Discharge Curve
3.1.5 Internal Resistance
3.1.6 Rechargeability
3.1.7 Cost
3.2 Battery Packs
3.3 6.270 Battery Charger

4 LEGO Design
4.1 Fundamental LEGO Lengths
4.2 LEGO Gearing
4.2.1 Gear Reduction
4.2.2 Chain Drives
4.2.3 Testing a Geartrain
4.2.4 Low-Force Geartrains

5 Sensor Design
5.1 Sensors as Tranducers
5.1.1 Analog and Digital Sensors
5.2 Sensor Inputs on the 6.270 Board
5.2.1 Analog Inputs
5.2.2 Digital Inputs
5.2.3 Connector Plug Standard
5.2.4 Sensor Input Wiring
5.2.5 The Voltage Divider Circuit
5.3 Tactile Sensors
5.3.1 Touch Switch
5.3.2 Bend Sensor
5.3.3 Potentiometer
5.4 Light Sensors
5.4.1 Photocell
5.4.2 Infrared Reectance Sensor
5.4.3 Infrared Slotted Optical Switch
5.4.4 Modulated Infrared Light Detector
5.5 Other Sensors
5.5.1 Magnetism Sensor
5.5.2 Motor Current Sensor

6 Robot Control
6.1 Basic Control Methods
6.1.1 Feedback Control
6.1.2 Open-Loop Control
6.1.3 Feed-Forward Control
6.1.4 Summary
6.2 Sensor Calibration
6.2.1 Manual Sensor Calibration
6.2.2 Dealing with Changing Environmental Conditions
6.2.3 Using Persistent Global Variables
6.3 Robot Control
6.3.1 Sensor Unreliability
6.3.2 Task-Oriented Control
6.3.3 Coordination of Tasks

7 IC Manual
7.1 Getting Started
7.2 Using IC
7.2.1 IC Commands
7.2.2 Line Editing
7.2.3 The main() Function
7.3 A Quick C Tutorial
7.4 Data Types, Operations, and Expressions
7.4.1 Variable Names
7.4.2 Data Types
7.4.3 Local and Global Variables
7.4.4 Constants
7.4.5 Operators
7.4.6 Assignment Operators and Expressions
7.4.7 Increment and Decrement Operators
7.4.8 Precedence and Order of Evaluation
7.5 Control Flow
7.5.1 Statements and Blocks
7.5.2 If-Else
7.5.3 While
7.5.4 For
7.5.5 Break
7.6 LCD Screen Printing
7.6.1 Printing Examples
7.6.2 Formatting Command Summary
7.6.3 Special Notes
7.7 Arrays and Pointers
7.7.1 Declaring and Initializing Arrays
7.7.2 Passing Arrays as Arguments
7.7.3 Declaring Pointer Variables
7.7.4 Passing Pointers as Arguments
7.8 The IC Library File
7.8.1 Output Control
7.8.2 Sensor Input
7.8.3 Time Commands
7.8.4 Tone Functions
7.9 Multi-Tasking
7.9.1 Overview
7.9.2 Creating New Processes
7.9.3 Destroying Processes
7.9.4 Process Management Commands
7.9.5 Process Management Library Functions
7.10 Floating Point Functions
7.11 Memory Access Functions
7.12 Error Handling
7.12.1 Compile-Time Errors
7.12.2 Run-Time Errors
7.13 Binary Programs
7.13.1 The Binary Source File
7.13.2 Interrupt-Driven Binary Programs
7.13.3 The Binary Object File
7.13.4 Loading an icb File
7.13.5 Passing Array Pointers to a Binary Program
7.14 IC File Formats and Management
7.14.1 C Programs
7.14.2 List Files
7.14.3 File and Function Management
7.15 Conguring IC

A Introduction to 6.270 157
A.1 Registration Policy
A.2 Kit Fee and Toolkit Fee
A.3 Team Organization
A.4 6.270 Alumni
A.5 Credit Guidelines
A.6 Schedule
A.6.1 Important Dates
A.6.2 Detailed Schedule of the Month’s Activities
A.7 Robo-Cup Contest Rules
A.7.1 Object
A.7.2 Balls
A.7.3 The Goal
A.7.4 Period of Play
A.7.5 Control
A.7.6 Infrared Beacon
A.7.7 The Contest Playing Table
A.7.8 Structure
A.7.9 The $10 Electronics Rule
A.7.10 Scoring
A.7.11 Organizers
A.8 Parts List

B 6.270 Hardware 183
B.1 The Microprocessor and Memory
B.1.1 Multiplexing Data and Address Signals
B.2 Memory Mapping
B.2.1 Memory-Mapping the RAM
B.2.2 Memory-Mapping with the 74HC138 Chip
B.2.3 System Memory Map
B.2.4 Digital Inputs
B.2.5 Digital Outputs
B.2.6 6811 and Memory Schematic
B.3 The Motor Drivers
B.3.1 The H-Bridge Circuit
B.3.2 The H-Bridge with Enable Circuitry
B.3.3 The SGS-Thomson Motor Driver Chip
B.3.4 Power Considerations
B.3.5 Expansion Board Motor and LED Circuitry
B.4 Analog Inputs
B.4.1 Motor Current Monitoring Circuit
B.4.2 Analog Input Multiplexing on the Expansion Board
B.5 The Serial Line Circuit
B.5.1 Serial Output
B.5.2 Serial Input
B.6 Battery-Backing the Static RAM
B.6.1 Powering the Memory Chip
B.6.2 The Power-O Interrupt
B.6.3 The Power-Up Delays
B.7 The Infrared Transmission Circuit
B.7.1 The IR Beacon
B.8 The LCD Display
B.9 The Low-Battery Indicator

C Printed Circuit Layouts 215
C.1 Microprocessor Board
C.2 Expansion Board
C.3 Battery Charger Board
C.4 Motor Switch Board
C.5 Infrared Beacon Board

D Electronic Suppliers 221
D.1 Introduction
D.1.1 Retail Suppliers
D.1.2 Surplus Suppliers
D.1.3 Ordering Catalogs
D.2 The Surplus Companies
D.2.1 Surplus Company Listing
D.3 The Retail Companies

Introduction to this Guide

These course notes contain a lot of information that should be valuable in your robot-
building endeavor. Here’s a brief synopsis of the organization of these course notes:
 Chapter 1 is the assembly manual for nearly all of the components used to construct a 6.270 robot|including the printed circuit boards, electronic sensors, motors, and battery packs.
 Chapter 2 introduces robot motor technology.
 Chapter 3 discusses battery technology and battery charger operation.
 Chapter 4 discusses secret construction methods using the LEGO Technics (R)
building materials.
 Chapter 5 delves into robotic sensors, explaining the principles of operation and applications of various sensors in the 6.270 kit.
 Chapter 6 investigates how to program a mobile robot to face up to the uncer-tainties and challenges of practical operation.
 Chapter 7 is a reference manual for the C language software that has beendeveloped for the 6.270 contest.Four appendix sections provide additional material:
 Appendix A is the student’s introduction to the 1992 class, covering administrative information, the month’s schedule, and the contest rules.
 Appendix B explains the workings of the 6.270 hardware, including the microprocessor board, the expansion board, and the infrared circuitry. This sectionis written with the assumption of some prior background in electronics.
 Appendix C provides reproductions of the printed circuit board layouts, handy for reference when debugging.
 Appendix D contains an introduction to ordering electronic parts from both the retail and surplus markets, and a listing of more than twenty top suppliers.

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